Solder Pads/Test Points <author>Created by librarian@cadsoft.de</author> SOLDER PAD drill 1.0 mm >NAME >VALUE SOLDER PAD drill 1.0 mm >NAME SOLDER PAD drill 1.0 mm, distributor Buerklin, 12H555 <h2>Seeed Studio XIAO Series Library</h2> This library is for the Seeed Studio XIAO series of boards. We have done our best to maintain the accuracy of our libraries but mistakes happen and we like to think that anything can be improved. If you have any feedback or suggestions please get in touch with us at <a href="mailto:fusion@seeed.io?Subject=Regarding%20the%20Seeed%20Studio%20XIAO%20Eagle%20Library" target="_top">fusion@seeed.io</a> The Seeed Studio XIAO series of miniature development boards have a unique through-hole/surface mount design that allows them to be used as a typical development board for breadboard prototyping for example or modules suitable for batch SMT assembly thanks to the hybrid thruhole-castellated hole pad design and single-sided assembly. This, along with the tiny form factor, integrated USB type-C port, low-power consumption and low cost make these boards ideal for wearable projects, distributed IoT applications and in other space-constrained, low-power situations. Find out more about the ever-expanding family of Seeed Studio XIAO modules at <a href=" www.seeedstudio.com">Seeedstudio.com</a>. This library was brought to you by: <h3>Seeed Fusion Service</h3> <a href="www.seeedstudio.com/prototype-pcb-assembly.html">Seeed Fusion Turnkey PCB Assembly service</a> can cater to your PCB assembly needs. From parts procurement, PCB manufacture to assembly, Seeed Fusion has the expertise and supply chain connections to ensure the success of your project. Whether you need parts from Digikey, Mouser or cheaper Asian alternatives, high PCB layer counts, exotic substrates or low MOQs, Seeed's flexible and agile manufacturing capabilities can to cater to all needs. Now all PCBA orders include Design for Assembly (DFA) review and PCB Design for Manufacture (DFM) review absolutely free. Try our <a href="www.seeedstudio.com/fusion_pcb.html">smart online quotation platform</a> and get a complete quotation in seconds. <a href="https://www.seeedstudio.com/fusion.html">Seeed Fusion Homepage</a> Last updated 2022/08/10 >NAME >VALUE Seeed Studio XIAO >NAME >VALUE Seeed Studio XIAO >NAME >VALUE <h2>Seeed Studio XIAO Series Through-hole Footprint and Symbol</h2> Basic through-hole footprint for Seeed XIAO series of boards. The underside surface mount pads are disabled. For through-hole mounting, a pair of 7-pin, 2.54mm pitch headers with 0.64x0.64mm square leads are recommended. The hybrid variant allows the assembler to choose between surface mount and through-hole mounting methods. However, there is a risk of solder leakage and therefore insufficient solder at the joints if soldering using solder paste and stencils, so we advise using this footprint only when the module is intended to be hand soldered. The symbol pin labels are generic. Please refer to the specific board for more information. Seeed Studio XIAO SAMD21 (Seeeduino XIAO) is also available pre-soldered: Seeed Studio XIAO SAMD21 Pre-soldered - Microchip ATSAMD21G18 Arduino Microcontroller with headers Seeed SKU: 102010388 <a href="https://www.seeedstudio.com/Seeeduino-XIAO-Pre-Soldered-p-4747.html">Buy now</a> Resistors, Potentiometers, TrimPot Chip, 1.05 X 0.54 X 0.40 mm body Chip package with body size 1.05 X 0.54 X 0.40 mm >NAME >VALUE Chip, 1.60 X 0.82 X 0.60 mm body Chip package with body size 1.60 X 0.82 X 0.60 mm >NAME >VALUE Chip, 2.00 X 1.25 X 0.65 mm body Chip package with body size 2.00 X 1.25 X 0.65 mm >NAME >VALUE Chip, 3.20 X 1.60 X 0.70 mm body Chip package with body size 3.20 X 1.60 X 0.70 mm >NAME >VALUE Chip, 3.20 X 2.49 X 0.71 mm body Chip package with body size 3.20 X 2.49 X 0.71 mm >NAME >VALUE Chip, 5.00 X 2.50 X 0.71 mm body Chip package with body size 5.00 X 2.50 X 0.71 mm >NAME >VALUE Chip, 6.30 X 3.20 X 0.71 mm body Chip package with body size 6.30 X 3.20 X 0.71 mm >NAME >VALUE AXIAL Resistor, 11.76 mm pitch, 8.5 mm body length, 2.5 mm body diameter AXIAL Resistor package with 11.76 mm pitch, 0.63 mm lead diameter, 8.5 mm body length and 2.5 mm body diameter >NAME >VALUE MELF, 3.50 mm length, 1.52 mm diameter MELF Resistor package with 3.50 mm length and 1.52 mm diameter >NAME >VALUE MELF, 2.00 mm length, 1.40 mm diameter MELF Resistor package with 2.00 mm length and 1.40 mm diameter >NAME >VALUE MELF, 5.90 mm length, 2.45 mm diameter MELF Resistor package with 5.90 mm length and 2.45 mm diameter >NAME >VALUE MELF, 3.20 mm length, 1.80 mm diameter MELF Resistor package with 3.20 mm length and 1.80 mm diameter >NAME >VALUE Axial Resistor, 7.24 mm pitch, 3.81 mm body length, 1.78 mm body diameter Axial Resistor package with 7.24 mm pitch (lead spacing), 0.46 mm lead diameter, 3.81 mm body length and 1.78 mm body diameter >NAME >VALUE Chip, 1.05 X 0.54 X 0.40 mm body Chip package with body size 1.05 X 0.54 X 0.40 mm Chip, 1.60 X 0.82 X 0.60 mm body Chip package with body size 1.60 X 0.82 X 0.60 mm Chip, 2.00 X 1.25 X 0.65 mm body Chip package with body size 2.00 X 1.25 X 0.65 mm Chip, 3.20 X 1.60 X 0.70 mm body Chip package with body size 3.20 X 1.60 X 0.70 mm Chip, 3.20 X 2.49 X 0.71 mm body Chip package with body size 3.20 X 2.49 X 0.71 mm Chip, 5.00 X 2.50 X 0.71 mm body Chip package with body size 5.00 X 2.50 X 0.71 mm Chip, 6.30 X 3.20 X 0.71 mm body Chip package with body size 6.30 X 3.20 X 0.71 mm AXIAL Resistor, 11.76 mm pitch, 8.5 mm body length, 2.5 mm body diameter AXIAL Resistor package with 11.76 mm pitch, 0.63 mm lead diameter, 8.5 mm body length and 2.5 mm body diameter MELF, 3.50 mm length, 1.52 mm diameter MELF Resistor package with 3.50 mm length and 1.52 mm diameter MELF, 2.00 mm length, 1.40 mm diameter MELF Resistor package with 2.00 mm length and 1.40 mm diameter MELF, 5.90 mm length, 2.45 mm diameter MELF Resistor package with 5.90 mm length and 2.45 mm diameter MELF, 3.20 mm length, 1.80 mm diameter MELF Resistor package with 3.20 mm length and 1.80 mm diameter Axial Resistor, 7.24 mm pitch, 3.81 mm body length, 1.78 mm body diameter Axial Resistor package with 7.24 mm pitch (lead spacing), 0.46 mm lead diameter, 3.81 mm body length and 1.78 mm body diameter RESISTOR >NAME >SPICEMODEL >VALUE >SPICEEXTRA Resistor Fixed - Generic Supply Symbols GND, VCC, 0V, +5V, -5V, etc. Please keep in mind, that these devices are necessary for the automatic wiring of the supply signals. The pin name defined in the symbol is identical to the net which is to be wired automatically. In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic. <author>Created by librarian@cadsoft.de</author> >VALUE SUPPLY SYMBOL >NAME 1 >NAME >VALUE Omron Switches <author>Created by librarian@cadsoft.de</author> OMRON SWITCH >NAME >VALUE 1 2 3 4 OMRON SWITCH >NAME >VALUE OMRON SWITCH Since Version 6.2.2 text objects can contain more than one line, which will not be processed correctly with this version. Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version. Since Version 8.4, EAGLE supports properties for SPICE simulation. Probes in schematics and SPICE mapping objects found in parts and library devices will not be understood with this version. Update EAGLE to the latest version for full support of SPICE simulation.